Abstract

The electrodeposition of gold is a key technology in the fabrication of many microsystem devices comprising gold composites with improved electronic and mechanical properties [1]. Multiwalled carbon nanotubes (CNT) of 20–40 nm in diameter were obtained by catalytic decomposition of acetylene on an iron catalyst. Ultradispersed diamond (UDD) was obtained by detonation synthesis (Caspio SA, Switzerland). Gold composites were electroplated using a sulphite gold electroplating bath with a CNT loading of 3 g/l and a UDD loading of 20 g/l, respectively [2].

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