CHARACTERISATION OF ELECTROPLATED EUTECTIC Sn-Ag SOLDER

Abstract

International Journal of Computational Engineering ScienceVol. 04, No. 03, pp. 733-736 (2003) Poster PapersNo AccessCHARACTERISATION OF ELECTROPLATED EUTECTIC Sn-Ag SOLDERZ. W. ZHONG, K. C. CHAN and Y. H. CHENZ. W. ZHONGNanyang Technological University, School of Mechanical & Production Engineering, Nanyang Avenue, Singapore 639798, Singapore Search for more papers by this author , K. C. CHANMicroFab Technology (S) Pte Ltd, 2 Woodlands Sector 1, Woodlands Spectrum #01-20, Singapore 738068, Singapore Search for more papers by this author and Y. H. CHENNanyang Technological University, School of Mechanical & Production Engineering, Nanyang Avenue, Singapore 639798, Singapore Search for more papers by this author https://doi.org/10.1142/S1465876303002167Cited by:2 Previous AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThis paper discusses the effects of electro-deposition processing conditions on the film composition and surface morphology. The rate of Ag deposition onto the bump depends on various processing parameters like current density, agitation and temperature. Among these parameters, the Ag content in the bump was found to be most sesitive to current plating density. At various Ag content, the morphology of the deposited solder was found to be different. This is due to the different types of drain growth at different Ag content. A high content bump was found with a needle-like Ag3Sn structure. This strcuture is believed to be the cause for the reduction in shear strength.Keywords:Sn-Agbump compositionsurface morphologyshear strength References H. Ezawa, M. Miyata and S. Homma, Eutectic Sn-Ag solder bump process for ULSI flip chip technology, Proc. 50th Electronic Components and Technology Conference, USA, (2000) 1095-1100 . Google Scholar S. Arai, H. Akatsuka, N. Kaneko, N. Shinohara and S. Wakabayashi, Sn-Ag solder bump formation for flip-chip bonding using electroplating method, Proc. 2nd International Conference on Electronics Packaging, Japan, (2002) 178-183 . Google Scholar S. Arai, Sn-Ag solder bump forming using electroplating method, Proc. of Symposium on Microjoining and Assembly Technology in Electronics, Japan, (1997) 59-64 . Google ScholarD. W. Hendersonet al., Journal of Material Research 17(11), 2775 (2002). Crossref, Google Scholar FiguresReferencesRelatedDetailsCited By 2Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder jointsPeriannan Arulvanan, Zhaowei Zhong and Xunqing Shi1 Feb 2006 | Microelectronics Reliability, Vol. 46, No. 2-4Lead‐free PCB assembly and effects of process conditions on the profile and reliability of solder jointsZ.W. Zhong, P. Arulvanan and X.Q. Shi1 Dec 2005 | Soldering & Surface Mount Technology, Vol. 17, No. 4 Recommended Vol. 04, No. 03 Metrics History Keywords Sn-Ag bump compositionsurface morphologyshear strengthPDF download