Abstract
Abstract The constitutive behaviour of Sn96.5Ag3.5, Sn95.5Ag4Cu0.5 and Sn63Pb37 solder was investigated on ultra small flip chip solder joints ( V =1×10 −12 m 3 ). In order to run experiments on these small specimens, a micro shear tester has been designed. The tester is optimised to achieve high precision. It is able to record force displacement hysteresis with a resolution of better than 1 mN and 20 nm for force and displacement measurements, respectively. It was found that the creep behaviour of the lead-free solders exhibit a very high dependence on stress (Sn96.5Ag3.5: n =11; Sn95.5Ag4Cu0.5: n =18), while the eutectic SnPb showed a low stress dependence of n =2.
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