Abstract
The potential impact of neurocompatible implantable devices to assist millions who suffer from brain and spinal cord injury or limb loss is tremendous, both in restoring patient health, as well as quality of life. Until now, no known reliable solution to this challenge has been found, with most of the current technology relying on nonneurocompatible materials such as silicon, tungsten, or platinum, and polymer insulators. Silicon carbide (SiC) and, in particular cubic-silicon carbide (3C–SiC), appears to be an ideal material to meet this challenging application: the evidence of bio- and hemocompatibility is increasing; it is a semiconductor that allows for tailored doping profiles and the seamless integration of electronics with the implants; it is highly durable, even within harsh, corrosive environments; and SiC is also an excellent thermal conductor. For the first time, a comprehensive analysis of 3C–SiC for neural device applications has been performed and is reported here. Starting with in vitro data from chapter: Cytotoxicity of 3C–SiC Investigated Through Strict Adherence to ISO 10993 and hemocompatibility data from chapter: Study of the Hemocompatibility of 3C–SiC and a-SiC Films Using ISO 10993-4, we add compelling in vivo biocompatibility data from two animal models to complete the 3C–SiC biological profile. We end by demonstrating advanced probe designs combining 3C–SiC neural probes with fully wireless-capable, application-specific neural recording chips. This chapter encompasses all of the required technology necessary to bring this material system to clinical trial. Additionally, we show that 3C–SiC is compatible within 2T field magnetic resonance imaging (MRI), which, if true for higher field MRI scanners, could revolutionize the way patients can receive diagnosis for advanced neurological disorders.
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