Abstract
Chemical mechanical polishing (CMP) is a powerful fabrication technique that uses chemical oxidation and mechanical abrasion to remove material and achieve very high levels of planarity. In this chapter, the theory and practice of CMP are discussed. Representative tools for both polishing and cleaning are described, as are the various system components. The damascene method of fabrication for copper features is described in detail. The theoretical underpinnings of CMP are discussed, with an emphasis on the electrochemistry of copper. The current literature is also surveyed, and several polishing models are summarized. Finally, new CMP techniques and components, driven by the adoption of new materials in the microelectronics industry, are discussed.
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