Chapter 1 - Introduction

Abstract

This chapter explains how various functional materials, such as semiconductors, glass or dielectric, magnetic, ceramic, metallic or macromolecular materials have been used for recent electronic and optical devices, and have produced high performance and diversification. Fabrication processes involve lapping, polishing and ultraprecision polishing. For crystal materials such as electronic/optical devices, lapping and polishing are used as a preprocessing and ultraprecision polishing finishing step. When brittle materials such as silicon or glass are used in lapping, the material breaks down, accompanied by crack creation as a result of the mechanical action of hard abrasives. Polishing, however, can produce a mirror finish by a micronized mechanical action that causes microcracks to accumulate. Current optical and metallographic ultraprecision polishing methods are an extension of conventional methods, and can include chemical/physical approaches. This book attempts to explain the ultraprecision process technologies which are indispensable for producing high performance devices and equipment.