Abstract
AbstractVariations in absolute Auger intensity of as much as 40% are reported for the analysis of polycrystalline copper surfaces in a high resolution scanning Auger microprobe. The angular dependent Auger yield is correlated with channeling effects of the incident electron beam. A correction procedure based upon ratioing the Auger peak intensity to the elastically backscattered electron peak, combined with an angular averaging technique can reduce the crystallographically induced Auger yield variations by a factor of four.
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