Abstract
In this paper, the design guidance of the channel in a through-silicon via (TSV) based three-dimensional integrated circuit (3D IC) for wide system bandwidth was described. First, the multi-stacked TSV and the silicon interposer interconnects were modeled for efficient analysis. Based on these developed models of the 3D IC interconnect, the multi-stacked TSV and the silicon interposer interconnect for wide single-channel bandwidths were analyzed. Finally, the optimized structure of the 3D IC interconnect for wide system bandwidth was obtained by consideration with the number of I/Os. This design guidance can be extended to different 3D IC system by using the analysis of the interconnect characteristic of TSV and the silicon interposer.
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