Abstract
The objects of the study were polycrystalline copper of M00b grade and commercially pure titanium BT1-0. Microindentation was carried out on the samples of titanium BT1-0 in the initial state, immediately after magnetic field exposure of 0.4 T and after certain time intervals. The defect substructure of cooper samples M00b, subjected to loading to failure in the creep mode under the influence of magnetic field of 0.35 T and without it, was investigated by the methods of electron diffraction microscopy. It was revealed that the effect of magnetic field exposure on commercially pure titanium BT1-0 leads to the decrease in microhardness with the subsequent stabilization during the time that depends on the processing parameters. And the effect of the magnetic field exposure on copper during the process of creeping results in the redistribution of dislocation substructure types. Also, there are changes in quantitative characteristics of dislocation substructures.
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