Abstract
Abstract This paper will focus on the technical challenges and solutions that a packaging and/or equipment engineer faces during the encapsulation of a large format substrate - either a wafer or panel substrate. This form of packaging is known as Large Format Packaging (LFP). The technical challenges and solutions discussed here include encapsulant, material dispensing strategies, direction of encapsulation, warpage management and challenges for LFP going forward. LFP as a packaging solution is an option worth exploring when the end user is willing to address its set of engineering challenges appropriately.
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