Challenges of Digital Twin Technologies Integration in Modular Construction: A Case from a Manufacturer’s Perspective

Abstract

Automated models of physical objects are known as Digital twins; letting one to outline, test, array, and monitor and manage robotics in the real world. .CPS (Cyber-physical system) data have to be assembled through real life procedures to form a real-time monitoring cyber model in order to produce Digital Twin. Modification in the cyber model will be shown in real life system to guess or manage. As a result of digital and the progression in ICT, manufacturing and aviation or aerospace industries are now utilizing digital twin. Nonetheless, the uses of DT's in several production firms have not been researched massively. Those studies were sparse in construction, where structures are built without Superstructures, which thus sparked global concern. Herein, DT applications in building/manufacturing sector and in various firms were reviewed first and thereafter aimed on publications concerning DT applications in industry area by organizing a systematic search via Scopus. Notably, the publications were singled out immediately after the assessment of the publications and the study continues to investigate and evaluate the Potentials of digital twins in MIC, Restriction of digital twins in MIC, Impact of digital twins on industry, and Cost of time which should be appropriate for model development. The analysis report however demonstrated that DT is dedicated and thoughtful of in midst of inclusion along other digital technologies. More so, theoretical structure is formed in order to apply DT in module installation in MiC around the circumstances of Hong Kong which happens to be usual city case of high-density. Interestingly, the implementation of Digital twin in Modular Integrated Construction is expected to provide promising potential with significant benefits, such as improved logistics and manufacturing management by employing Digital Twins to track on-site progress during module installation.