Abstract
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
Highlights
With the rising interest in Micro Electrical Mechanical Systems (MEMS) due to expanding application areas and new products opportunities the need for reliable and cost-effective MEMS development is becoming more and more important
Our research merely focuses on MEMS resonators using a Wafer Level Thin Film
The processing of a whole wafer in one go means that a large number of resonators can be packaged at once
Summary
With the rising interest in Micro Electrical Mechanical Systems (MEMS) due to expanding application areas and new products opportunities the need for reliable and cost-effective MEMS development is becoming more and more important. MEMS and traditional IC products are the (possible) use of moving parts. These can include: cantilevers, membranes and resonators. The processing of a whole wafer in one go means that a large number of resonators can be packaged at once. This results in a very low risk of contamination since the unsealed resonator does not leave the cleanroom. After the sealed resonator structure is created, the resonator can be used in a multi chip module and serve as an oscillator Besides these advantages, one of the main drawbacks is the fragile nature of the WLTFP.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
