Abstract
Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the package and heat removal from the package/heat sink module. Power dissipation and package cooling characteristics of high-performance microprocessors are analyzed. The development of a new metallic thermal interface technology is introduced, where thermal and mechanical performance of an indium-silver alloy in the chip/heat spreader assembly was studied. The paper also reports on research on other thermal management materials, such as diamond composite heat-spreading materials. Some actual package designs are described to illustrate the enhanced heat spreading capability of heat pipes and vapor chambers.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
