Abstract
AbstractA family of new high performance thermoplastic polyimide adhesives have been developed that can be directly laminated to ceramic substrates, polyimide films, metals, and/or sputter metallized for eventual circuit fabrication. We have also developed new heat-sealable composite polyimide films that have improved CTE, that have good dimensional stability and that can also be directly bonded to ceramic and glass-ceramic substrates. With these new material sets various constructions of ceramic-polyimide rigid-flex systems can be conceived to meet the more demanding needs of the electronics industry. We have laminated these films to metals and various ceramic substrates such as alumina, aluminum nitride, glass, etc. and investigated the bond stabilities under thermal and humidity aging conditions.
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