Ceramic Microfabrication Techniques for Microdevices with Three-Dimensional Architecture

Abstract

ABSTRACTThe term “microfabrication” has been used primarily as an acronym for silicon-based device fabrication. Recent developments in ceramic processing technology have resulted in cost-effective, scalable options of ceramic microfabrication that offer the potential for fabrication of devices with a number of advantages over silicon-based microdevices for specific applications. These advantages include the ability to fabricate devices with three-dimensional architecture, high-temperature operation up to 1200°C, porous layers for gas diffusion, and textured substrate properties for specific applications through wider materials selection. Processing routes for these ceramic microdevices with three-dimensional architecture include established processes such as tape casting, laser machining, lamination and sintering, or new processes such as reaction bonding and lost-mold techniques. The ability to fabricate three-dimensional feature geometries allows the application of these ceramic microfabrication techniques for device fabrication targeted at a number of applications such as point-of-use high purity gas generation, microchannel devices, microreactors, fiber-optic connectors and heat-pipes for microelectronics.