Ceramic Film Packaging for 2-D Thermal Wind Sensor Using LTCC Technology

Abstract

In this paper, the design, fabrication, and characterization of a robust MEMS thermal wind sensor utilizing ceramic hlm packaging are proposed. The ceramic hlm is fabricated by means of low temperature co-hred ceramic (LTCC) technology, achieving the excellent adhesion between silicon substrate and ceramic hlm without any thermal adhesive. The most important is that the adverse effects of the packaging on the performance of the thermal wind sensor can be minimized by adjusting the thickness and thermal conductivity of the ceramic hlm during the preparation of the ceramic slurry. The influences of thickness and thermal conductivity of ceramic hlm on the performance of sensor have been simulated by hnite element method, and the results are in reasonable agreement with theoretical analysis. The proposed sensors were tested and calibrated in a wind tunnel. Experiments results demonstrate that the sensitivity of the proposed sensor is decreased only 4.7%, compared with the sensor without ceramic hlm. The maximum measurement error of the proposed sensor in wind speed and direction is 0.66 m/s and 5%, respectively. Compared with the sensor packaged with 250μm ceramic carrier, the heating power of the proposed sensor is reduced by nearly 50% and the sensitivity is increased by an order of magnitude at the same time.