Abstract
Laminate composites of polymer resins reinforced by certain ceramic fibers exhibit a very favorable combination of properties for advanced microelectronic packaging applications. With proper design, these composites utilize the ease of processing and desirably low dielectric constants of polymers and the high thermal conductivity and dimensional stability of ceramics. Besides selecting appropriate material components, other key considerations in composite design include specifying (1) the directionality as well as magnitude for desired properties, and (2) the degree of component connectivity in various composite directions by controlling filler shape, orientation, loading, and processing. We report electrical and thermal properties of alumina-fiber—polyimide composites as a function of fiber loading, and show their agreement with predictions from theory. The inplane thermal conductivities and expansivities are dominated by the fiber whereas the out-of-plane dielectric constant is comparable with the polymer matrix. Faster, denser microelectronic devices are envisioned, combining the electrical performance of polymers with the thermal performance of ceramics.
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