Abstract
Ceramic column grid array (CCGA) devices are presently the state-of-the-art packaging solutions for advanced computational electronics. For high-reliability applications incorporating thermal and vibration loads, CCGA columns provide more compliant interconnect during thermal cycle of the assembly and improve interconnection reliability by design. Assembly of such high interconnect count device requires process development and qualification prior to their deployment in space borne payloads. CCGA assembly process development, comprehensive assembly qualification tests (thermal cycling, vibration, humidity, microsectioning, and 3-D Computed Tomography X-ray inspection), and reliability estimation are presented in this paper.
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