Causes of Ag, Cu, and Ni electrode seizure in low-voltage pulsed discharge deposition

Abstract

The seizure of Ag, Cu, and Ni electrodes in low-voltage pulse discharges during coating of a copper plate is studied. It is established that nickel tends to seizure because of the high surface tension of its melts, which prevents the evacuation of the liquid metal from the anode surface, and also of its relatively low heat conductivity, which limits the heat removal from the support spots of the discharge channel into the electrode. This results in the smooth surface of the electrode and increases the contact area and contact temperature of the electrode couple, which enhances the probability of seizure.