Cathodoluminescence study of luminescence centers in hexagonal and cubic phase GaN hetero-integrated on Si(100)

Abstract

Hexagonal and cubic GaN—integrated on on-axis Si(100) substrate by metalorganic chemical vapor deposition via selective epitaxy and hexagonal-to-cubic-phase transition, respectively—are studied by temperature- and injection-intensity-dependent cathodoluminescence to explore the origins of their respective luminescence centers. In hexagonal (cubic) GaN integrated on Si, we identify at room temperature the near band edge luminescence at 3.43 eV (3.22 eV), and a defect peak at 2.21 eV (2.72 eV). At low temperature, we report additional hexagonal (cubic) GaN bound exciton transition at 3.49 eV (3.28 eV), and a donor-to-acceptor transition at 3.31 eV (3.18 eV and 2.95 eV). In cubic GaN, two defect-related acceptor energies are identified as 110 and 360 meV. For hexagonal (cubic) GaN (using Debye Temperature (β) of 600 K), Varshni coefficients of α=7.37±0.13×10−4 (6.83±0.22×10−4)eV/K and E0=3.51±0.01 (3.31±0.01) eV are extracted. Hexagonal and cubic GaN integrated on CMOS compatible on-axis Si(100) are shown to be promising materials for next generation devices.