Abstract

We investigated limiting factors of carrier lifetimes and their enhancement by post-growth processes in lightly-doped p-type 4H-SiC epitaxial layers (N A ∼ 2 × 1014 cm−3). We focused on bulk recombination, surface recombination, and interface recombination at the epilayer/substrate, respectively. The carrier lifetime of 2.8 μs in an as-grown epilayer was improved to 10 μs by the combination of VC-elimination processes and hydrogen annealing. By employing surface passivation with deposited SiO2 followed by POCl3 annealing, a long carrier lifetime of 16 μs was obtained in an oxidized epilayer. By investigating carrier lifetimes in a self-standing p-type epilayer, it was revealed that the interface recombination at the epilayer/substrate was smaller than the surface recombination on a bare surface. We found that the VC-elimination process, hydrogen annealing, and surface passivation are all important for improving carrier lifetimes in lightly-doped p-type epilayers.

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