Abstract
The thermal dissipation issue of electronics devices becomes increasingly prominent as they evolve to smaller sizes and more complicated structures. Therefore, the development of materials with excellent heat conduction properties and light weight turns out to be an urgent demand to solve the heat transfer problem of electronics devices with high performance. For this purpose, we put forward an innovative strategy that carbonized dehydroascorbic acid (CDA) be applied to graphene layers for the targeted repair of defects among them and bridge connection of the layers to produce graphene heat conduction materials with excellent properties. Firstly, hydrogen bonds formed from dehydroascorbic acid (DHAA, products of the oxidation of vitamin C) and each of ketone, carboxyl, and oxhydryl groups on graphene layers were absorbed at targeted locations where oxidation graphene produces defects, then targeted repair was conducted for those defects to be filled and for the graphene layers of a small size to grow into large sheet materials with improved continuity by CDA generated in thermally pressing reduction reaction at 800 °C. In our investigation, the planar thermal conductivity of rGO/VC membrane reached 1031.9 ± 10.2 Wm−1K−1, while the added mass content of vitamin C (VC) was 15%. Being a reference, the planar thermal conductivity of primitive graphene membrane was only 610.7 ± 11.7 Wm−1K−1.
Highlights
As microelectronics technology develops rapidly, various electronic devices have evolved with light weight, small size, and high performance leading to higher and higher integration levels in integrated circuits
When the mass content of added vitamin C was 15%, the planar thermal conductivity of rGO/VC film can reach the maximum value of 1031.9 ± 10.2 Wm−1K−1, which was increased by 69.0% compared with the original GFs
Compared with the traditional stronger reducing reagent, Vitamin C was less effective than reducing agents such as hydroiodic acid and hydrazine hydrate; it is an environmentally friendly reducing reagent, and its composition of the elements was consistent with the graphene oxide which is helpful to avoid generation of phonon scattering caused by impurity atoms [24]
Summary
As microelectronics technology develops rapidly, various electronic devices have evolved with light weight, small size, and high performance leading to higher and higher integration levels in integrated circuits. This gives rise to an increasingly prominent problem of heat dissipation. When the mass content of added vitamin C was 15%, the planar thermal conductivity of rGO/VC film can reach the maximum value of 1031.9 ± 10.2 Wm−1K−1, which was increased by 69.0% compared with the original GFs. we provide a promising method for preparing graphene paper with excellent heat transfer properties which is expected to be widely used in the field of thermal management and heat dissipation of electronic devices
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