Abstract
It is a great challenge to develop thermal interface materials that enable fast heat transfer between the surface of microelectronic materials and heat sinks. In this paper, multi-walled carbon nanotube/epoxy composites (EP-NH2-x) were synthesized by amidation reaction using aminated epoxy resin as matrix and carboxylated multi-walled carbon nanotubes. EP-NH2-x can reduce the interfacial thermal resistance and the promotion of phonon conduction through the chemical bonding connection between the resin and the carbon nanotubes, which will in turn improve the thermal conductivity of the composites. The thermal conductivity of EP-NH2-10 reaches 0.531 W·m−1·K−1 at a and has good variable temperature cycling stability, internal elasticity and surface adhesion. This work highlights the potential application of carbon materials to improve the thermal conductivity of epoxy resins.
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