Carbon Doped Silicon Emitters Fabricated Using Limited Reaction Processing

Abstract

ABSTRACTThis paper describes the deposition of in-situ doped N-type silicon carbide layers in a Limited Reaction Processing (LRP) reactor. Silane/propane/ phosphine gas chemistry was used at temperatures less than 1000°C and SIMS, XPS and TEM analysis techniques aided layer characterisation. A low thermal budget deposition process (1 min at 970°C) was employed to form the emitters of Sic/Si heterojunction NPN bipolar transistors. These devices yielded a factor of two increase in emitter Gummel number compared to diffused emitters.