Caractérisation mécanique des films minces

Abstract

The extensive use of thin films in the manufacture of microelectronic devices and for protection against wear and corrosion has stimulated considerable interest in their mechanical properties. This kind of study requires the development and use of non-traditional mechanical testing techniques. The most widely used testing methods of free standing films and of films adherent to their substrates are reviewed with an emphasis on their strengths and liabilities. Results obtained by these methods are discussed.