Capture and emission mechanisms of defect states at interface between nitride semiconductor and gate oxides in GaN-based metal-oxide-semiconductor power transistors

Abstract

A physical insight into the capture and emission behavior of interface/oxide states in a GaN-based metal-oxide-semiconductor (MOS) structure is of great importance to understanding the threshold voltage (VTH) instability in GaN power transistors. A time-dependent VTH shift in Ni/Al2O3/AlGaN/GaN MOS-HFETs (heterojunction field-effect transistors) and a distribution of Al2O3/III-nitride interface states (Dit) were successfully characterized by constant-capacitance deep level transient spectroscopy. It is found that in situ remote plasma pretreatments in plasma-enhanced atomic-layer-deposition could suppress Dit (EC-ET > 0.4 eV) down to below 1.3 × 1012 cm−2 eV−1. Under high applied gate bias (e.g., VG > 8 V), tunnel filling of oxide states in the Al2O3 dielectric comes into play, contributing to remarkable VTH instability in the MOS-HFETs. The tunnel distance between the 2D Electron Gas (2DEG) channel and oxide states ET,ox in the Al2O3 dielectric decreases from 3.75 to 0.82 nm as VG increases from 2 to 8 V. A further increase of VG to 11 V makes the Fermi level approach ET,ox (EC − ET ∼ 1.62 eV), which may enable direct filling. High electric field induced tunnel filling of gate oxide states could be an assignable cause for VTH instability in normally-OFF III-nitride MOS-HFETs.