Camera Module Design, Assembly and Test Challenges

Abstract

With the fast growth of mobile phone market, image sensor and camera module production have skyrocketed in recent years. Semiconductor industry has been put a lot of effort in camera module design, assembly, and test technologies. The technology platform was mainly developed from normal BGA platform. However, camera module is more complex than normal BGA in design, assembly, and test. There were special issues to be taken into consideration. In this paper, challenges of camera module design, assembly and test are discussed. Integrated analysis methodology was addressed for camera module design. Through the analysis of optical and mechanical tilt, module flexibility, loading force during test, reliability test, etc, it is clearly stated that design for assembly, design for test, and design for reliability are very important to create a higher yield product. Integrating theoretical analysis, numerical modeling, and physical test can help to have a fast solution and significantly reduce time to market and time to volume.