Abstract
Computer calculation of pure metal film thickness distribution, using vacuum arc deposition technique, is presented in this paper. For random arc with a lower arc current, a model of single cathode spot with ion beam flux taking into account the cosine function spatial distribution is deduced. For arc steered by an external magnetic field, which is parallel to the cathode surface, a multiple cathode spots model is developed. And, in the case of random arc, calculation comparison between static substrate and rotating substrate is made. Results show that film thickness distribution is non-uniform when the arc is not controlled and tends to be uniform when the arc is steered by external parallel magnetic field with cathode geometry and substrate location being well chosen. Also, film thickness distribution is more uniform on a rotating substrate than on a static substrate.
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