Abstract
The paper presents a method to find the effective thermal conductivity and effective volumetric heat capacity values of PWBs from the results of thermal transient measurements and a series of subsequent evaluation steps. Various powering and temperature sensing methods were investigated. The experiments show the feasibility of creating a method for obtaining effective thermal parameters of printed wiring boards with the help of usual thermal transient testers.
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More From: IEEE Transactions on Components and Packaging Technologies
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