Abstract
The authors have calculated the resistivity introduced in copper by spherical cavities of different sizes. These voids are represented by square potentials whose height is calculated in order to determine exactly the influence of the screening conduction electrons. The diffusion problem has been completely solved by the partial wave method. The supplementary resistivity increment due to one vacancy exhibits a small maximum for voids composed of two vacancies, and slowly decreases for the larger cavities. This resistivity increment is only decreased by one-half of its initial value for voids containing 100 vacancies. The effective diffusion cross-section is still much smaller, in this case, than the classical cross-section of a hard sphere of the same radius.
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