C10 マイクロレンズアレイ金型の精密加工と計測(OS11 超精密加工(2))

Abstract

Needs of aspheric lenses are increasing for digital cameras or mobile phone. In the conventional fabrication process, molded axis-symmetric aspheric lenses were assembled on the CCD chip. In this conventional process, productivity was not high and new assembly process is required. Recently, WLC (Wafer Level Camera) fabrication process is proposed. In this report, precision machining of micro lens array mold is examined. Electronless Ni array mold is machined with micro milling tool made of single crystal diamond and the accuracies of the array mold are evaluated.