Abstract
Abstract Early life failures are usually attributed to problems in the manufacturing, packaging, and assembling phases. After making improvements to the greatest possible extent in these phases, the only way to improve the product's reliability is to eliminate defective units before they reach customers. A common approach used to weed out defective and weak parts before shipping the products to customers is burn‐in testing. Burn‐in testing has become a frequently used procedure in many industries, especially the semiconductor industry. In this article, an overview of burn‐in testing is presented and its applications are explained. Burn‐in methods are related to a variety of failure mechanisms and the conditions under which the tests are run are specified. Finally, the burn‐in time is determined through a reliability bathtub curve model to be the time after which the failure rate remains constant.
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