Abstract
Investigation of thin film buckling is important for life prediction of MEMS device which are damaged mainly by the delamination and buckling of thin films. In this paper�» the mechanical and thermal properties of compressed thin film titanium films with 150 nm thickness deposited on an organic glass substrate under mechanical and thermal loads were measured and characterized. In order to simulate the thin films which subjected to compound loads and the buckle modes�» the external uniaxial compression and thermal loading were subjected to the specimen by the symmetric loading device and the electrical film in this experiment. The temperature of the thin film deposited on substrate was measured using thermoelectric couple. The range of temperature accords with the temperature range of the MEMS. It is found that the size and number of the delamination and buckling of the film are depended upon the pre-fixed mechanical loading and thermal temperature. The thermal transient conduction and thermal stability of the film and substrate was studied with finite element method.
Highlights
IntroductionFilm/substrate structure in information science occupies an important position, for example, data storage and processing systems on integrated circuits contain a large number of conductive, semi-conductive and insulating films, the magnetic films which play a key role in the disk storage systems, etc
The above-mentioned thin film/substrate system withstand a variety of load at work, thermal stress caused by the heat, especially the residual stress in the film, either the thermal mismatch produced in the high-temperature deposition process and the subsequent cooling process, or the internal stress caused by lattice mismatch [1]
When the temperature dropped to the initial state, thin film returned to the original straight-sided topology with expansion at the front of buckles
Summary
Film/substrate structure in information science occupies an important position, for example, data storage and processing systems on integrated circuits contain a large number of conductive, semi-conductive and insulating films, the magnetic films which play a key role in the disk storage systems, etc W. Moon [7] is that the varicose mode is the transition model from the straight-sided wrinkle to the telephone cord buckle. With the stress increase of in buckling load the straight-sided wrinkle will change to the telephone cord buckle.
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