Bubble behaviour and critical heat flux investigations on electrodeposited metallic tubes during pool boiling

Abstract

There is colossal research scope in achieving greater functionality and durability in microelectronic devices as conventional air cooling systems cannot handle these devices' cooling requirements which may be due to their low heat transfer performance. In such instances, phase change heat transfer mechanisms are appropriate for heat extraction since they utilise both sensible and latent heat. The ability to remove huge amount of heat at low wall superheats and the lack of moving parts make pool boiling appealing. This experimental study emphasises the analysis of bubble behaviour and critical heat flux (CHF) on electrodeposited tubes developed via in-house built set-up. Copper has been deposited over SS 304 tubes of a length of 100 mm and diameter of 2.5–4.5 mm. Their surface morphologies have been investigated using various characterization techniques such as SEM, EDS, AFM, and XRD. The surface roughness measurement confirms that electrodeposition increases the roughness of the tube. The contact angle analysis confirms that the coated surfaces are hydrophobic in nature. The CHF visualization is carried out under uniform heat flux conditions. It is observed that with an increase in diameter, the magnitude of CHF reduces irrespective of the coated and uncoated surface. The hydrophobic surface exhibits a lesser CHF magnitude than the uncoated surface. The reduction in CHF magnitude is within a range of 4.27%–8.93%. At lower heat flux magnitude, the bubble nucleation is rigorous in coated tubes, making it efficient for phase change heat transfer applications.