Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Abstract

A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-generation (5G) wireless communication is proposed. The monopole taper radiator is adopted for the proposed Yagi antenna design to miniaturize the size, extend the bandwidth, and simplify the feeding network. The proposed AiP design is broadband enough to cover all three 5G New Radio bands simultaneously. The high-precision high-resolution multilayered glass packaging fabrication process with a new low-loss polymer material coating is adopted to realize the circuit. The operation band is from 24.25 to 40 GHz and the fractional bandwidth is 49%. The overall size for an antenna element is 3.05 mm × 5.56 mm, which is equal to 0.25 $\lambda _0$ × 0.45 $\lambda _0$ . The measured $S_{11}$ is smaller than $-$ 10 dB within the entire band and the gain is larger than 4 dBi. A two-by-one array using the proposed element is also demonstrated with a gain higher than 6.2 dBi within the entire band. Compared with previous works, the proposed AiP design can cover all 5G bands with a competitive size. Thus, it is suitable to be applied to massive arrays and easily integrated into packages to achieve compact system-in-package applications while resolving numerous current 5G challenges, including millimeter-wave (mm-wave) path loss and transmission loss.