Abstract
How to enhance the thermal transport across interfaces? There is a common sense that increasing the interfacial bonding strength can facilitate the phonon transport. Recently in Science Advances, Shiomi and colleagues experimentally reported a counterintuitive discovery that a weak bonded interface can transport more heat than a strong bonded interface via the bridging effect rather than the binding effect in a highly mismatched heterointerface. The comprehensive and inspiring advance on interfacial heat transport is highlighted, and some brief introduction of the state-of-the-art progress, challenges, and future directions are outlined for the thermal management of nanoelectronics and nanoelectromechanical systems.
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