Abstract
Reliability is at the heart of any system to function efficiently. Besides having a great development in the field of power electronic semiconductors, there is still a question of existing challenges. One of the significant challenges that needs great attention is state of damage prediction as it impacts the efficiency and reliability (lifetime) of the system. Therefore, the study's objective is to implement a new non-destructive testing method to detect the failure mechanisms and predict their influence. To illustrate, the Direct bonded copper ceramic substrates, namely Si3N4 with clip bonds undergo passive cycling test. As a result, they experience aging of brazing followed by clip failure examined by S–parameter transmitted and reflected waves.
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