Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films.

Özgün Güzdemir,Sagar Kanhere,Victor Bermudez,Amod A Ogale

doi:10.3390/polym13193393

Özgün Güzdemir, Sagar Kanhere + Show 2 more

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https://doi.org/10.3390/polym13193393

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Journal: Polymers	Publication Date: Oct 2, 2021
Citations: 8	License type: CC BY 4.0

Affiliation: Adnan Menderes University, Clemson University

Abstract

With shrinking size of electronic devices, increasing performance and accompanying heat dissipation, there is a need for efficient removal of this heat through packaging materials. Polymer materials are attractive packaging materials given their low density and electrical insulating properties, but they lack sufficient thermal conductivity that inhibits heat transfer rate. Hexagonal boron nitride (BN) possesses excellent thermal conductivity and is also electrically insulating, therefore BN-filled polymer composites were investigated in this study. Results showed successful continuous extrusion of BN-filled linear low-density polyethylene through micro-textured dies that is a scalable manufacturing process. Through-thickness thermal conductivity measurements established that 30 vol% BN content led to an over 500% increase in thermal conductivity over that of pure polymer. Textured film surface provided about a 50% increase in surface area when compared with non-textured films. This combination of increased surface area and enhanced thermal conductivity of BN-filled textured films indicates their potential application for improved convective thermal transport.

Highlights

In the last few decades, the fast rate of development of consumer electronics has resulted in a wide variety of miniaturized devices that run faster processors and are expected to operate for longer periods of time [1]
Electronic packaging typically has a large surface area to enable increase in convective heat flow, but large surface of electrically conducting material can lead to undesired displacement current flow [7]
We investigate the continuous melt extrusion of micro-textured boron nitride (BN)-filled linear low-density polyethylene composite films because it has not been systematically investigated in the literature

Summary

Introduction

In the last few decades, the fast rate of development of consumer electronics has resulted in a wide variety of miniaturized devices that run faster processors and are expected to operate for longer periods of time [1]. Polymers are an attractive material for electronic packaging because of their light weight, low cost, ease of processing, and electrical insulating properties that prevents noise or voltage drop in the electric signals [6,8,9,10]. Their use in applications requiring thermal management is limited by their low thermal conductivity, about 0.1–0.5 W/m·K [11]. Carbon-based fillers such as graphite, carbon fibers and carbon nanotubes, and ceramic particles such as Al2O3, SiC, and hexagonal boron nitride (BN) are used [14,15]

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