Abstract
Printed circuit-board and IC-package design used to be a field that involved expertise in layout, CAD, logic design, heat transfer, mechanical engineering, and reliability analysis. With modern digital electronic systems pushing beyond the 1-GHz barrier, packaging and board designers must now balance signal and power integrity and electrical performance with these other concerns. In our new “highspeed” world, where the packaging and interconnect are no longer electrically transparent to the signals, a new methodology for designing a product right the first time is needed. This new methodology is based on predictability.
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