Abstract
A fracture mechanics approach is used to determine the critical fluid pressure needed to debond the interface ahead of a microchannel which is fabricated by wafer bonding techniques. The relation between the effective bonding energy of the wafer bonding interface and the critical pressure is given in closed form. Detailed finite element simulations are carried out to verify our analytical model. Our analysis shows that the energy release rate computed using beam theory can be considerably lower than the actual release rate. The critical pressure of polydimethylsiloxane (PDMS)/silicon microchannels was also determined by experiments. Using our analytical model, the effective bonding energy was obtained at different partial curing temperatures. For example, the maximum effective bonding energy is found to be 1.48 J m−2 at a curing temperature of 115 °C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
