Abstract
High-temperature joining is a key technology for electronic component assembly and other high-temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a new joining technology for high-temperature applications. In this study, a feasibility study was conducted to determine whether chestnut-burr-like microscale Ag particles can be used for joint material, and the shear strength of the Cu-to-Cu joints was investigated. Then, the interfacial microstructure of the joints using the microscale particle paste was examined. As a result, joining using microscale Ag particles was successfully achieved and the shear strength of more than 20 MPa was obtained under nitrogen atmosphere.
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