Abstract
Bonding strength of a metal (Fe-Ni alloy) and resin (epoxy base) adhering interface was examined under thermal stress occurring in the cooling process of the thermoset resin after adhesion. Thermal stresses on the adhering interface were calculated using the finite element method. Calculated stresses and the experimental strength were compared. The following results were obtained. Bonding strength of a metal and resin adhering interface under thermal loads can be estimated mainly by using shearing stress on the adhering interface (τyz) ; an accurate strength estimation can be obtained by taking into account the normal stress on the adhering interface (σz).
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: JSME international journal. Ser. 1, Solid mechanics, strength of materials
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.