Abstract
In this work, the ultrasonic assisted active metal soldering of silica glasses was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250 °C in ambient atmosphere. A nano-crystalline layer of R-TiO2 with an average thickness of 7.6 nm formed at the interface between silica glasses and Sn-2Ti solder filler, which verified that a sono-oxidation reaction has occurred during the ultrasonic assisted active metal soldering process. The soldered butt joints exhibited an average tensile strength of 25.3 MPa.
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