Bonding mechanism of laser joining of Poly-Ether-Ether-Ketone film which used for 5G antenna substrate to copper foil

Abstract

The bonding of copper foil to Poly Ether Ether Ketone (PEEK) film has become a hotspot in research of the 5G RF (Radio Frequency) antenna substrate. In order to make the flexible copper clad laminates(FCCL) in the RF substrate thinner and more resistant to bending, there is an urgent need to replace the use of adhesive to join the copper foil to the PEEK film with a direct joining method. In this paper, a nanosecond laser was used to join the copper foil to the PEEK film effectively and the comprehensive property of joint was enhanced by the laser-textured grid on the surface of copper foil. The influence of textured grid on the adhesion work between copper foil and PEEK film was investigated. The interfacial morphology was observed and the result showed that molten PEEK completely filled the textured grid and formed a mechanical interlocking with copper. The complex reaction between Cu and PEEK was indicated by detecting the red-shift for the wave number of functional groups and the weak chemical bond between Cu and PEEK. Besides, the bonding mechanism was proved by density functional theory (DFT) calculation. The tensile shear strength of Cu/PEEK joint was significantly enhanced by laser texturing treatment, and the maximum force of joint with 0.4 mm-textured grid was increased by approximately 1.29 times compared to the untreated condition. This study proposes the use of nanosecond laser joining to replace the traditional use of adhesives to join copper foils to PEEK films.