Abstract
In this study, the hot compression bonding (HCB) tests of 2196 Al-Cu-Li alloy were carried out under different temperatures, strain rates and strains. The interfacial microstructure evolution and bonding mechanism were investigated in detail. The effects of deformation parameters on the bonding quality were revealed, and the processing window for HCB was determined. The preconditions of realizing interfacial bonding are the discontinuous dynamic recrystallization (dDRX) induced by grain boundary bulging or particle-stimulated nucleation (PSN), and the subsequent migration of interface grain boundary (IGB). As strain increases, the bonding quality is improved significantly. The elevated interfacial pressure and quick dDRX behavior under high strain rate are also favorable for bonding. The optimal processing window for HCB was determined as temperatures ranging from 470 to 525 °C and strain rates of 0.6 to 1 s−1. An expression of activation energy (Qw) for HCB was proposed to quantitatively evaluate the combined effects of strain, bonding time and interfacial pressure on the bonding quality. It was found that the strength of most bonding joints can be more than 80% of strength of the base material when the Qw is larger than 1.2.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
