Abstract
In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.
Highlights
Vacuum packaging plays a critical role in the electronics industry, as it is necessary for maximizing performance and extending product life[1,2,3]
Optimizing the Pt layer thickness As Ti atoms rapidly diffuse into Au and prevent bonding, the Ti underlayer atoms should be blocked by the Pt layer for hermetic sealing after degassing
It is believed that the 5-nmthick Pt layer on the Ti layer was a continuous film, but the 2.5-nm-thick layer was a discontinuous island structure
Summary
Vacuum packaging plays a critical role in the electronics industry, as it is necessary for maximizing performance and extending product life[1,2,3]. Getter materials that can absorb reactive gases are used to eliminate residual gas molecules in a package[4,5,6]. Thin layers that consist of reactive metals, such as Ti, V, and Zr, coated with an inactive layer, such as oxides and Au7, are common. They are called non-evaporative getter (NEG) films. The underlayer metal atoms diffuse into the inner surface of the package and absorb the residual gases by activating the NEG film at a high temperature after packaging[7,8,9,10]
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