Abstract
Abstract The feasibility of using radio-frequency (RF) dielectric heating to cure thermoset adhesives has been evaluated. Thermoset and thermoplastic polymer panels have been bonded to steel using conventional one-and two-part epoxy and two-part urethane adhesives. Process cycle times for adhesive cure using RF heating were about 20 to 60 seconds, compared with about 20 to 30 minutes for the same materials using conventional oven-cure methods. Thermoset substrates bonded included glass fibre-reinforced composite panels based on sheet moulding compound (SMC) and resin transfer moulding styrene-vinylester (RTM). Thermoplastics such as polycarbonate, polyarylate, Noryl, ABS and polymethylmethacrylate were also successfully bonded. RF bonding experiments were performed by preparing and testing lap-shear joints as well as by joining a large test structure with a 25 mm x 1.25 m bondline. Bonding of painted steel to SMC composite, SMC to SMC and steel to RTM composite were also accomplished using the RF dielectric heating process.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
