Abstract
Sonic devices requiring a large fractional band-width, such as delay lines, light deflectors etc., can be given a low insertion loss if transducers with a high electro-mechanical coupling factor are used. Such transducers are as yet unobtainable by thin-film deposition methods. However, with recently developed bonding and precision machining techniques, high performance transducers can be made with various ceramic and single-crystal materials. Epoxy bonding has been useful up to 100MHz, but bonding with intermediate indium films in combination with additional metal layers is shown to have potential for devices operating up to 1GHz.
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