Bonded aircraft repairs under variable amplitude fatigue loading and at low temperatures

Abstract

Bonded repairs can replace mechanically fastened repairs for aircraft structures. Compared to mechanical fastening, adhesive bonding provides a more uniform and efficient load transfer into the patch, and can reduce the risk of high stress concentrations caused by additional fastener holes necessary for riveted repairs. Previous fatigue tests on bonded Glare (glass‐reinforced aluminium laminate) repairs were performed at room temperature and under constant amplitude fatigue loading. However, the realistic operating temperature of −40 °C may degrade the material and will cause unfavourable thermal stresses. Bonded repair specimens were tested at −40 °C and other specimens were tested at room temperature after subjecting them to temperature cycles. Also, tests were performed with a realistic C‐5A Galaxy fuselage fatigue spectrum at room temperature. The behaviour of Glare repair patches was compared with boron/epoxy ones with equal extensional stiffness. The thermal cycles before fatigue cycling did not degrade the repair. A constant temperature of −40 °C during the mechanical fatigue load had a favourable effect on the fatigue crack growth rate. Glare repair patches showed lower crack growth rates than boron/epoxy repairs. Finite element analyses revealed that the higher crack growth rates for boron/epoxy repairs are caused by the higher thermal stresses induced by the curing of the adhesive. The fatigue crack growth rate under spectrum loading could be accurately predicted with stress intensity factors calculated by finite element modelling and cycle‐by‐cycle integration that neglected interaction effects of the different stress amplitudes, which is possible because stress intensities at the crack tip under the repair patch remain small. For an accurate prediction it was necessary to use an effective stress intensity factor that is a function of the stress ratio at the crack tip Rcrack tip including the thermal stress under the bonded patch.