Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

Abstract

The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.